Sequential Lamination: The Backbone of Circuit Board FabricationThe most fundamental manufacturing technique in modern PCB Fabrication is Sequential Lamination. Simply put, this term describes the process of building up a PCB layer by layer, using multiple subcomposites of copper and insulating PCB Laminate Material. This technique allows for the completion of complex tasks such as trace routing on internal copper layers, as well as the drilling of Blind and Buried Vias. Without Sequential Lamination, it simply would not be possible to produce the complex High-Density Interconnect (HDI) PCBs that are steadily becoming more commonplace across all electronics industries. So how does this important technology work, and what do you need to know as a PCB designer to ensure a flawless Sequential Lamination process for your upcoming project with Bittele?
The good news here is that your responsibilities regarding Sequential Lamination are fairly straightforward. Among your PCB Design Files should be a document called the PCB Multi-Layer Stackup, which describes the order and specific thicknesses of each layer to be laminated together. Bittele’s production engineers can even provide assistance in creating a detailed stackup for your project, including complex considerations such as Impedance Control. If your HDI design does require special attention for features such as Micro-Vias, we recommend that you refer to our comprehensive DFM Guidelines document for complete details on our capabilities and design rules where these elements are concerned.
With your stackup completed, you can leave the actual specifics of the Sequential Lamination process to us. Bittele’s process engineering team will build your PCB from the middle out, starting with the Prepreg and working out to the external surfaces of the finished board. The copper layers are subjected individually to trace routing, and blind/buried vias are drilled out as each new layer is laminated onto the board in progress. The actual lamination process involves state of the art PCB Fabrication machinery that is able to apply high amounts of temperature and pressure to the subcomposites, adhering them permanently to one another. Once the lamination is complete, any mounting holes and through vias are drilled through the fully laminated product, and your order is all set for the final stages of Silkscreen, Surface Finish, and finally the PCB Assembly Process can begin.
We hope that this brief explanation has acted to clear up any queries or uncertainties you might have had with regard to the Sequential Lamination process. If you do have any remaining questions, we would be happy to hear from you! To send along those questions, or to get an official quotation for our Complete PCB Assembly services today, you can Contact us over email at firstname.lastname@example.org, or give us a call toll-free at 1-888-812-1949.
- Multi-Layer PCB: Stack-Ups and Basics
- Multi-layer Printed Circuit Board Fabrication Services
- What is a HDI PCB?
- High Frequency PCB Materials
- How Copper Planes and Fills Affect PCB Fabrication and PCB Assembly