Multi-layer Printed Circuit Board Fabrication Services

Bittele Electronics specializes in the latest PCB technologies, which has enabled us to provide High Quality PCB Fabrication and High Quality PCB Assembly for Multi-Layer Printed Circuit Boards (PCBs) and High Density Interconnect (HDI) PCBs to our clients worldwide. Our operations are based in North America, and we offer PCB Assembly in Canada, meaning our flexible and robust PCB Assembly Process follows meticulous North American Quality Standards. We take pride in offering high quality multi-layer circuit boards, including our specialty service of Complete PCB Assembly, allowing our clients to get ahead of the competition and meet demands for higher reliability with the help of our extensive manufacturing capabilities.

Our multi-layer fabrication capabilities include a variety of specifications:
  • Multi-layer Circuit Board up to 30 Layers
  • Maximum Board Size: 500 mm x 800 mm (19.7”x 31.5”)
  • PCB Thickness: 0.8 mm – 2.4 mm (0.032” – 0.094”)
  • Minimum Track Width: 0.3 mm (0.012”)
  • Minimum Track Spacing: 0.3 mm (0.012”)
  • Minimum drill hole diameter: 0.6 mm (0.023”)
  • Controlled Impedance
  • Via types : Blind Vias, Buried Vias, Plugged Vias, etc.
We are extremely flexible in terms of your PCB Stackup, allowing for you to specify your own thicknesses for each and every part of the design, but we also offer a number of standard stackup options for your convenience. By default, we use a standard overall PCB Thickness of 1.6mm (0.062”), and we also provide standardized options for 0.2mm (0.0079″), 0.4mm (0.016″), 0.6mm (0.024″), 0.8 mm (0.032″), 1.0 mm (0.04″), 1.2mm (0.047″), 2.0mm (0.079″), and 2.3mm (0.091″) PCB thicknesses.

For your convenience, we offer a selection of materials specifically intended for high-frequency designs, such as those produced by Rogers, and High Temperature PCB Materials, such as High TG FR-4. These optional PCB laminate materials are provided upon customer request during the quotation stage of the project, and will require some additional cost and special consideration during the DFM Checking and PCB Fabrication stages of multi-layer PCB fabrication.

To get started on your multi-layer PCB fabrication project today, you can send your PCB Design Files in to, and make sure to include any special requirements, such as customized stackups or optional laminate materials. These options can be noted in the design files themselves, and should also be mentioned in the body of your initial inquiry email. Our experienced staff of PCB Customer Service Experts will review your files and quickly develop your personalized official quotation, while working with you to clarify any initial questions. Once the order is placed, we undertake a detailed DFM check and Manufacturing Rules Check (MRC) to ensure that the production process will be flawlessly to your satisfaction. This initial verification process is a part of our detail-oriented Quality Management philosophy, which targets continual improvement for the benefit of our valued clients. Repeated confirmation at every stage of the process, allows us to fix any errors at an early stage to avoid costly and time-consuming rework.

In order to deliver superior-quality multi-layered PCBs, we employ a variety of thorough inspection and testing techniques. We use full Electrical Testing (E-Test) to identify short circuits or open circuits across the board to ensure that the nets of the fabricated PCBs match exactly to the nets in the clients design files. Automated Optical Inspection (AOI) is used to authenticate the inner layers of multi-layer PCBs, check for missing pads, identify spacing/line width violations, etc. We provide both of these verification methods as standard options included in the default cost of your quote, as well as repeated Visual Inspection at every stage of production. Optional testing methods such as X-Ray Inspection for lead-less packages like BGA Assembly can be priced out using Bittele’s Online Price Calculator. We also offer highly customizable testing for your specific design, such as Functional Testing, and In-Circuit Testing, for your convenience.

We have an instant online quote tool for PCB Fabrication available to our clients, allowing you to develop a clear estimate for the costs and turnaround time of multi-layer printed circuit board fabrication before your design files are fully finished. You can also contact us any time for additional information that might not be captured by our online tools. Our sales team will get back to you as soon as possible with the most appropriate solution.

Here is an example of Bittele’s pricing for multi-layer circuit board fabrication services in North America:
  • board size 2.93” × 3.19”
  • thickness 0.062”
  • layers: 6
  • copper weight: 1 oz.
  • solder mask: green
  • material: FR4
  • silk screen: white
  • double sided
  • surface finish: ENIG
  • electrical testing

The cost of a board with the above specifications would be $726.89 for 50 Boards, and $1066.81 for 100 Boards, with a turnaround time of 7 days.


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