We have a wealth of experience handling all types of BGAs, including DSBGA and other Complex Components, from micro BGAs (2mmX3mm) to large size BGAs (45 mm); from ceramic BGAs to plastic BGAs. We are capable of placing minimum 0.4 mm pitch BGAs on your PCB.
BGA Assembly Process/Thermal profiles
Thermal profile is of utmost importance for BGA in the PCB Assembly Process. Our production team will conduct a careful DFM Check to review both your PCB files and the BGA datasheet to develop an optimized thermal profile for your BGA assembly process. We will take the BGA size and BGA ball material composition (leaded or Lead-Free) into consideration to make effective thermal profiles. When the BGA physical size is large, we will optimize the thermal profile to localize the heating on the internal BGA to prevent joint voids and other Common PCB Assembly Faults. We follow the IPC Class II or Class III Quality Management guidelines to make sure any voids are under 25% of the total solder ball diameter. Lead-free BGAs will go through a specialized lead-free thermal profile to avoid open ball problems that can result from the lower temperatures; on the other hand, leaded BGAs will go through a specialized leaded process to prevent higher temperatures from causing pin shorts. When we receive your Turn-Key PCB Assembly order, we will check your PCB design to review any considerations specific to BGA components during our meticulous DFM (Design for Manufacturability) review. The full verification includes checks for the PCB Laminate Material compatibility, Surface Finish effects, maximum warpage requirement and Solder Mask clearance. All these factors affect the quality of BGA assembly.
BGA soldering, BGA Rework & Reballing
You may have only a few BGAs or fine pitch parts on your PC boards that require PCB assembly for R&D prototyping. Bittele can help — we provide a specialized BGA soldering service for testing and evaluation purposes as a part of our focus on Prototype PCB Assembly. Additionally, we can assist you with BGA rework and BGA reballing at an affordable price! We follow five basic steps to perform BGA rework: component removal, site preparation, solder paste application, BGA replacement, and Reflow Soldering. We guarantee that 100% of your boards will be fully functional when they are returned to you.
BGA Assembly X-Ray Inspection
We use an X-Ray machine to detect various defects which might occur during BGA assembly.
Through X-ray inspection, we can eliminate soldering problems on the board, such as Solder Balls and Paste Bridging. Also, our X-Ray support software can calculate the gap size in the ball to make sure it follows IPC Class II or Class III standards, as per your requirements. Our experienced technicians can also use 2D X-rays to render 3D images in order to check such problems as broken PCB vias, including Via in Pad BGA Designs and Blind / Buried Vias for inner layers, as well as cold solder joints in BGA balls.