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What Are the Standard Electrical Properties for Bittele's PCB Materials

Bittele Electronics uses a variety of different materials to serve your printed circuit board needs. The purpose of these materials is to provide the necessary insulation between the conducting copper layers and obviously conduct the electricity. The most commonly used PCB material is the FR-4, however, Bittele offers a variety of other materials that can be used to serve your boards specific needs. The chart below will show our most commonly used materials and this article will provide a bit more information regarding them to help you with your selection.

Material TypeMaterial we have in stock
FR4 TG140S1000H, IT158
FR4 TG170S1000-2, IT180A, TU768
Rogers materialRo4350B, Ro4003, Ro3003
Polymide materialSH260
Flex materialSF202
CoverlaySF305

FR4 TG140

The first material we use under this type is the S1000H. Some general features of this material are:
  • Lead-free compatible
  • Excellent thermal reliability
  • Low Z-axis CTE
  • Good in anti-CAF performance and IST
  • Low water absorption

Applications:

  • Computer and NB
  • Instruments
  • Consumer electronics
  • Automotive electronics
  • Power supplier and industrial

General properties



Another material we use under this type is the IT158. Some general features of this material are:
  • Lead-free assembly compatible
    • RoHS compliant and suitable for high thermal reliability needs and Lead-free assemblies with a maximum reflow temperature of 260°C.
  • Advanced resin technology
    • Industrial standard material with medium Tg (150°C by DSC) multifunctional filled epoxy resin and excellent thermal reliability.
  • Friendly processing and CAF resistance
    • Friendly to PCB process that users can easily handle the process by current equipment and chemical.
  • CAF resistance
    • Excellent thermal reliability and CAF resistance providing long-term reliability for industrial boards and automobile application.
  • Available in a variety of Constructions
    • Available in a various of constructions, copper weights and glass styles, including standard (HTE), RTF and VLP copper foil.

General properties



FR4 TG170

One material we use under this type is the S1000-2. Some general features of this material are:
  • Lead-free compatible FR-4 laminate
  • Tg 170°C (DSC), UV Blocking / AOI compatible
  • High heat resistance
  • Lower Z-axis CTE
  • Excellent through-hole reliability
  • Excellent anti-CAF performance
  • Lower water absorption

Applications

  • Suitable for high aspect ratio and high-layer PCB
  • Widely used in computer, communication equipment, precise apparatus and instrument, routers, etc.

General Properties



Another material we use under this type is the IT1A80A. Some general features of this material are:
  • Advanced High Tg Resin Technology
    • Industrial standard material with high Tg (175°C by DSC) multifunctional filled epoxy resin and excellent thermal reliability.
  • Lead-Free Assembly Compatible
    • RoHS compliant and suitable for high thermal reliability needs and lead-free assemblies with a maximum reflow temperature of 260°C.
  • Friendly Processing and CAF Resistance
    • Friendly PCB process like high Tg FR4. Users can short the learning curve when using this material.
  • CAF Resistance
    • Low thermal expansion coefficient (CTE) helps to excellent thermal reliability and CAF resistance providing long-term reliability for industrial boards and automobile application.
  • Available in Variety of Constructions
    • Available in a various of constructions, copper weights and glass styles, including standard (HTE), RTF and VLP copper foil.

Applications

  • Multilayer and High Layer PCB
  • Automobile
  • Backplanes
  • Servers and Networking
  • Telecommunications
  • Data Storage
  • Heavy Copper Application

General Properties



Another material we use under this type is the TU768. Some general features of this material are:
  • Lead Free process compatible
  • Excellent coefficient of thermal expansion
  • Anti-CAF property
  • Superior chemical and thermal resistance
  • Fluorescence for AOI
  • Moisture resistance

Applications

  • Consumer Electronics
  • Server, workstation
  • Automotive

General Properties



Rogers Material

Two materials we use under this type are the Ro4003 and Ro4350B. Some general features of these material are:
  • RO4000 materials are reinforced hydrocarbon/ceramic laminates – not PTFE
    • Designed for performance sensitive, high volume applications
  • Low dielectric tolerance and low loss
    • Excellent electrical performance
    • Allows applications with higher operating frequencies
    • Ideal for broadband applications
  • Stable electrical properties vs. frequency
    • Controlled impedance transmission lines
    • Repeatable design of filters
  • Low thermal coefficient of dielectric constant
    • Excellent dimensional stability
  • Low Z-axis expansion
    • Reliable plated through holes
  • Low in-plane expansion coefficient
    • Remains stable over an entire range of circuit processing temperatures
  • Volume manufacturing process
    • RO4000 laminates can be fabricated using standard glass epoxy processes
    • Competitively priced
  • CAF resistant

Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • RF Identification Tags
  • Automotive Radar and Sensors
  • LNB’s for Direct Broadcast Satellites

General Properties



Another material we use under this type is the Ro3003. Some general features of this material are:
  • Low dielectric loss (RO3003™ laminates)
    • Laminates can be used in applications up to 77 GHz.
  • Excellent mechanical properties versus temperature
    • Reliable stripline and multi-layer board constructions.
  • Uniform mechanical properties for a range of dielectric constants
    • Ideal for multi-layer board designs with a range of dielectric constants.
    • Suitable for use with epoxy glass multi-layer board hybrid designs.
  • Stable dielectric constant versus temperature and frequency (RO3003 laminates)
    • Ideal for band pass filters, microstrip patch antennas, and voltage-controlled oscillators.
  • Low in-plane expansion coefficient (match to copper)
    • Allows for more reliable surface mounted assemblies
    • Ideal for applications sensitive to temperature change
    • Excellent dimensional stability
  • Volume manufacturing process
    • Economical laminate pricing

Applications

  • Automotive radar applications
  • Global positioning satellite antennas
  • Cellular telecommunications systems - power amplifiers and antennas
  • Patch antenna for wireless communications
  • Direct broadcast satellites
  • Datalink on cable systems
  • Remote meter readers
  • Power backplanes

General properties



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