Bittele Electronics specializes in the latest technologies, which has enabled us to provide multi-layer printed circuit board (PCB) fabrication services in North America. We believe in offering high-quality, multi-layer circuit boards that allow our clients to get ahead of the competition and meet the demands of higher reliability with the help of our extensive manufacturing capabilities.
Our multi-layer fabrication capabilities include a variety of specifications:
Multi-layer Circuit Board up to 30 Layers
Maximum Board Size: 500 mm x 800 mm (19.7”x 31.5”)
PCB Thickness: 0.8 mm – 2.4 mm (0.032” – 0.094”)
Minimum Track Width: 0.3 mm (0.012”)
Minimum Track Spacing: 0.3 mm (0.012”)
Minimum drill hole diameter: 0.6 mm (0.023”)
Via types : blind, buried and plugged, etc.
We also offer different laminate thickness options.
We generally use the laminate thickness specified by our clients. However, the standard thickness offered is 1.6mm. In addition, we also provide other alternatives for laminate thickness, such as 0.2mm (0.0079″), 0.4mm (0.016″), 0.6mm (0.024″), 0.8 mm (0.032″), 1.0 mm (0.04″), 1.2mm (0.047″), 2.0mm (0.079″), and 2.3mm (0.091″). We also offer high-frequency materials such as those produced by Rogers, and high-heat-resistance base materials such as High TG FR-4, etc. These are subject to confirmation from the customer as they are quite expensive compared to standard materials and require special consideration during Design for Manufacturing (DFM) for multi-layer PCB fabrication.
You can send the required confirmation to email@example.com regarding usage of laminate materials to enable us to proceed with multi-layer fabrication. Our experienced staff first verifies the DFM, and undertakes a Manufacturing Rules Check (MRC) as per our standard guidelines, so as to identify any issues before multi-layer PCB fabrication. This process allows us to fix errors at very early stage so as to avoid reworking, which is a necessary part of our quality control methods.
In order to deliver superior-quality multi-layered PCBs, we employ a variety of inspection and testing techniques. We use Electrical-Test (E-Test) to identify short circuits, and open circuits so that the nets of the fabricated boards are as per the nets in the clients design file. Automated Optical Inspection (AOI) is used to authenticate the inner layers of multi-layers PCB, check for missing pads, identify spacing/line width violations, etc. If there are any additional charges associated with this, they can be determined from using Bittele’s online price calculator.
We have an instant online quote tool for PCB fabrication available to our clients to enable them to estimate the costs of multi-layer circuit board manufacture. Also, you can contact us for any related information: e.g., for turnaround time and quote details. Our sales team will get back to you with the most appropriate solution.
Here is an example of Bittele’s pricing for multi-layer circuit board fabrication services in North America:
board size 2.93” × 3.19”
copper weight: 1 oz.
solder mask: green
silk screen: white
surface finish: ENIG
The cost of a board with the above specifications would be $726.89 for 50 Boards, and $1066.81 for 100 Boards, with a turnaround time of 7 days.