Surface Mount Production Lines
In Bittele, we have three surface mount (SMT) production lines, each capable of working on prototype, low- and medium-volume PCB orders. Our state-of-the-art equipment helps us ensure the utmost quality of SMT circuit board production, in the timeliest manner possible.
After our sales and engineering teams have confirmed with our clients that their circuit board designs meet DFM and DFA guidelines, the client’s CAD files are used not only to manufacture PCBs, but also to program our pick-and-place machines, in order to mount SMT parts into the correct positions on the PCB. Once a PCB order is ready to be processed, our technicians prepare Our ASM solder paste printers for the first stage of production; SMT solder paste screening.
Once the PCBs have been screened with solder paste, they are then fed into the 3D solder paste inspection (SPI) machine to measure the accuracy of the screening, as well as the amount of solder paste applied onto the board. If the board passes inspection, it can proceed to the next stage of production. However, a failed inspection means the PCB will have to be rescreened once our technicians readjusts the solder paste printer to correct the issue.
Once the PCBs have been screened with solder paste, they are then processed by the pick-and-place machines. After our parts team has processed any SMT parts for an order, our technical staff will install their tape reels into specialized cartridges, which install into the pick-and-place machine in a similar manner to ink cartridges on an inkjet printer. The machine is then programmed using the client’s CAD files supplied for the order, so that the machine can match each component to the correct position on the PCB. Once fully setup, the machine will pick each part from the reel cartridges and place them into the correct position, where they will adhere onto the solder paste.
The boards are then sent to the 3D automated optical inspection (AOI) machine to ensure the accuracy of the pick-and-place machine, as well as to make sure that all components are installed properly before being sent to the solder reflow ovens to finalize the installation. Lastly, the first circuit board to complete the assembly process is taken to the first article inspection (FAI) machine, where the PCB is given an electrical test to confirm that the board’s desired electrical properties have been met.
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