Ball Grid Array (BGA) assemblyBittele Electronics Inc. is a renowned PCB Assembly service solution. It is capable of doing fine pitch assemblies that have less than 0.5 mm pitch. Bittele has been doing BGA soldering for a long time and it offers x-ray inspection for BGA soldering.
Bittele also does DFM check before sending gerber files to the assembly house which implies that the chances of error on BGA soldering, are none to zero.
The picture below is an xray of BGA soldering.
- What is a Ball Grid Array?
- Ball Grid Array Inspection
- BGA and QFN Reworking – Handling Accurate SMT Placement
- BGA Prototyping Boards
- Bittele's Capabilities for DSBGA and other Complex Components