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Buried or Blind Vias

Difference between Buried and Blind Vias:
Blind Vias are such vias which connect an outer layer to one or multiple inner layers thus they have an opening on the outer layer whereas buried vias are the ones which are buried between the outer layers and they only interconnect the inner layers.

Purpose of Buried and Blind Vias:
Space on the PCB board can be saved using buried and blind vias which allow the PCB tracks to be run over or under them without getting shorted. Most fine pitched BGA and flip chip IC footprints don’t support tracks to run under them or have vias. Here we can use buried or blind vias that avoid making connection to unwanted layers in a particular region thus saving precious space on the PCB.

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